Converting conventional office space into a Class 10K semiconductor cleanroom required an entirely new level of environmental control and process infrastructure. For a defense manufacturing client, TAI provided architecture and engineering design for wafer thinning and post-grind processing, integrating HEPA-filtered air handling, ESD raised-access flooring, and high-purity utilities including CDA, nitrogen, vacuum, DI water, and chilled water. Structural and electrical upgrades accommodated specialized equipment loads, supporting a compliant installation and reliable precision manufacturing.
A defense manufacturing client needed a Class 10K cleanroom for wafer thinning and post-grind processing, built within existing office space. The conversion had to fit cleanroom HVAC, high-purity process utilities, life-safety systems, and new equipment loads into a building not originally designed for semiconductor manufacturing.
TAI delivered architecture and engineering design for the full conversion. The design incorporated HEPA-filtered air handling, raised access flooring with ESD finishes, and process utilities including CDA, nitrogen, vacuum, DI water, and process chilled water. Structural and electrical upgrades carried the new manufacturing equipment and its loads. The finished design supported a compliant installation and reliable precision processing.
